System Level Solutions has full fledge capability to offer board designs - from schematic to final Gerber release to suit customer manufacturing requirements. SLS board design team has good experience in high speed board designs, multi-layered, multi-CPU and high performance board designs.

Whether it’s a board design or a system design, increased complexity and reduced design time are the challenges our customers face. SLS board design team takes all responsibility/challenge with our clients to deliver the best quality designs at right time.

Design Proceedure

•  Requirements Analysis - Design and Architecture specification



•  Design
•  Electronic component engineering
•  Power and Clock design
•  Enclosure Modeling, CAD Design


•  Implementation
•  Schematic
•  Placement and Routing
•  Signal Integrity


•  Prototyping
•  Fabrication
•  Assembly - In house
•  Packaging
•  Rapid Prototyping for Enclosures


•  Diagnostics
•  Reliability analysis
•  Thermal analysis
•  Pre and post layout signal integrity check and cross talk analysis
•  EMI and EMC analysis

Design Capabilities:

•  Schematic captures, Manual Routing



•  High Density Multi-layer Boards designing



•  Digital, Analog, Mixed Signal, Power and RF Designs



•  High-speed design rules and cross talk management



•  Blind and Buried via Designs



•  EMI / EMC design guidelines



•  BGA, Fine Line BGA & Micro-BGA Designs



•  DUT/LOAD card design and Burn-in board designs



•  RoHS Compliant Layout Design and fabrication

Complexity of Designs

•  Split POWER/ GROUND Planes



•  Number of Layers: Up to 24



•  Bus Speeds: 1.4 GHz with 32bit width



•  Controlled Impedance for Signals as well as Power Planes



•  Different Bus Topologies



•  Daisy Chain, Star and length Matched



•  Memory Interface Types: DDR, RD RAM, SSRAM, SDRAM, Serial/Parallel Flash and Flash Cards



•  High Speed I/O Interfaces: Multi Giga bit Serial Interface, High speed Ethernet, PCI Express, Optical Fiber,  VME Interface, RF Designs of 2.8 GHz



•  Blind and Buried Via Designs



•  Different Form Factors: PCI and PCI Express, PCI- Mezzanine, PCMCIA, PC103, Euro, Extended Euro



•  Components Packages: Micro- BGA, BGB VME Connectors etc.

Design Tools Experience

•  Cadence - OrCAD Capture



•  Cadence - OrCAD PSPICE



•  Cadence - OrCAD Layout



•  Cadence - Allegro



•  Mentor Graphics