The USB 2.0 (ULPI/OTG) Snap On Board is designed to provide connectivity between USB 2.0 Host / OTG controller and USB 2.0 Device IP core. The Snap On board provides a fast, versatile, and easy-to-use communication path for data exchange between the device and host. The board provides complete Hi-Speed USB 2.0 physical front-end solution that supports high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s).
Operates in Low Speed (1.5 Mbps), Full Speed (12Mbps) and High Speed (480Mbps).
ULPI PHY Chip - NXP ISP1504
Serial to Parallel and Parallel to Serial conversion
Provides 8-bit bidirectional data interface
A current limited External VBUS Power Switch with thermal shutdown
USB Mini AB-type connector
One Power LED and one User LED
Standard SantaCruz interface and GPIO interface support
Fully complies with:
Universal Serial Bus Specification Rev. 2.0
On-The-Go Supplement to the USB 2.0 Specification Rev. 1.2
The support services on the phone were commendable. Once we had SLS on the phone and in house they were very knowledgeable - Erik Malone, Qualcomm (USA)
Your software & electronic hardware(PCB Design,assembly etc) design capability is world class. - S.K.Biswas, BHEL (Bhopal, India)
I would like to thank you for your excellent support and willingness to help. I am glad that I did get to know SLS - Mauritz Zondagh, Saab (South Africa)
I'd like to congratulate the winners of the Echelon Innovator of the Year award. GreenWave Reality and SLS represent some of the very best customer benefits and technical achievements of the Smart Grid - Ron Sege, chairman and CEO of Echelon.