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System Level Solutions has full fledge capability to offer board designs - from schematic to final Gerber release to suit customer manufacturing requirements. SLS board design team has good experience in high speed board designs, multi-layered, multi-CPU and high performance board designs.

Whether it’s a board design or a system design, increased complexity and reduced design time are the challenges our customers face. SLS board design team takes all responsibility/challenge with our clients to deliver the best quality designs at right time.

 

Design Proceedure

  • Requirements Analysis - Design and Architecture specification
  • Design
    • Electronic component engineering
    • Power and Clock design
    • Enclosure Modeling, CAD Design
  • Implementation
    • Schematic
    • Placement and Routing
    • Signal Integrity
  • Prototyping
  • Translation services
    • Fabrication
    • Assembly - In house
    • Packaging
    • Rapid Prototyping for Enclosures
  • Diagnostics
    • Reliability analysis
    • Thermal analysis
    • Pre and post layout signal integrity check and cross talk analysis
    • EMI and EMC analysis

 

Design Capabilities:

  • Schematic captures, Manual Routing
  • High Density Multi-layer Boards designing
  • Digital, Analog, Mixed Signal, Power and RF Designs
  • High-speed design rules and cross talk management
  • Blind and Buried via Designs
  • EMI / EMC design guidelines
  • BGA, Fine Line BGA & Micro-BGA Designs
  • DUT/LOAD card design and Burn-in board designs
  • RoHS Compliant Layout Design and fabrication

 

Complexity of Designs

  • Split POWER/ GROUND Planes
  • Number of Layers: Up to 24
  • Bus Speeds: 1.4 GHz with 32bit width
  • Controlled Impedance for Signals as well as Power Planes
  • Different Bus Topologies
  • Daisy Chain, Star and length Matched
  • Memory Interface Types: DDR, RD RAM, SSRAM, SDRAM, Serial/Parallel Flash and Flash Cards
  • High Speed I/O Interfaces: Multi Giga bit Serial Interface, High speed Ethernet, PCI Express, Optical Fiber,  VME Interface, RF Designs of 2.8 GHz
  • Blind and Buried Via Designs
  • Different Form Factors: PCI and PCI Express, PCI- Mezzanine, PCMCIA, PC103, Euro, Extended Euro
  • Components Packages: Micro- BGA, BGB VME Connectors etc.

 

Design Tools Experience

  • Cadence - OrCAD Capture
  • Cadence - OrCAD PSPICE
  • Cadence - OrCAD Layout
  • Cadence - Allegro
  • Mentor Graphics

 

 

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Clients Talk

The support services on the phone were commendable. Once we had SLS on the phone and in house they were very knowledgeable - Erik Malone, Qualcomm (USA)